论文总字数：20874字

摘 要

聚酰亚胺(PI)是一种高性能聚合物材料,具有良好的机械、绝缘、耐辐射、耐腐蚀和耐高低温等性能，广泛应用于消防、电子、航天航空和军事工业等领域。但PI也存在一些缺点，如熔点太高不易加工、易水解、粘结能力差和生产成本高等。近年来,热塑性聚酰亚胺(TPI)的制备改性以及应用引起人们的关注。

本文选取均苯四甲酸二酐（PMDA），3,3',4,4'-联苯四羧酸二酐（BPDA），3,3',4,4'---二苯酮四酸二酐（BTDA）和DAMI为原料、以二甲基乙酰胺（DMA_C）为溶剂合成PMDA-DAMI，BPDA-DAMI，BTDA-DAMI型PI前躯体聚酰胺酸(PAA)，再通过常规热亚胺化制备TPI薄膜并将其用于两层挠性覆铜板上。通过红外光谱仪(FTIR)、万能测试仪等仪器表征了PI薄膜的结构、热性能、力学性能及其应用于两层挠性覆铜板(2L-FCCL)的剥离强度等性能。结果表明：合成的三种PI薄膜的拉伸强度均大于90MPa它们的玻璃化温度均在230℃以上；所制备的两层挠性覆铜板剥离强度良好；通过所拍剥离表面电镜图可知，聚酰亚胺与铜箔之间接触良好。

关键词：聚酰亚胺薄膜 挠性覆铜板 热膨胀系数

A Kind of Thermoplastic Polyimide For a Flexible Copper Clad Laminate

ABSTRACT

Polyimide (PI) is a polymer material with high performance,which has a good mechanical, insulation, radiation resistance, corrosion resistance and high and low temperature resistance and other properties, widely used in fire fighting, electronics, aerospace and military industry and other fields. However, there are still some shortcomings about PI, such as high melting point ,hard to process, easy to hydrolyze, poor bonding capacity and high cost of production. In recent years, the preparation,modification and application of thermoplastic polyimide (TPI) and work aroused people's concern.

Inthisarticle,Pyromellitic-dianhydride(PMDA),3,3',4,4'-biphenyltetracar-boxylicdianhydride(BPDA),3,3',4,4'-benzophenonetetracarboxylic dianhydride（BTDA）and DAMI as raw material, Dimethylacetamide (DMAc) as solvent are matched to compound PMDA-DAMI, BPDA-DAMI, BTDA-DAMI polyamide acid (PAA) which is a precursor of PI. TPI film used in the 2-layer flexible clad copper laminate can be prepared by routine thermal imidization. Then, thermal properties, mechanical properties of PI film are characterized by Fourier Transform Infrared Spectroscopy (FTIR), multiple-purpose tester . Peel strength and dimensional stability are also characterized when PI film applies to 2-layer flexible copper clad (2L- FCCL). The experiment result shows that the pulled intensity of PI is greater than 90MPa; and the glass transition temperature is at least 230℃. To the 2-layer flexible clad copper, all of them have high peel strength; and the electron micrographs of the 2-layer flexible clad copper’s surface after peeled off show that the polyimide and the copper splices very well.

KEYWORDS: PI film, flexible copper clad, thermal expansion coefficient

目 录

摘要 I

ABSTRACT II

第一章 文献综述 1

1.1 聚酰亚胺 1

1.1.1 聚酰亚胺简介 1

1.1.2 聚酰亚胺的分类 1

1.1.3 热塑性聚酰亚胺 1

1.1.4 聚酰亚胺的性能及用途 3

1.1.5 聚酰亚胺薄膜的生产工艺 4

1.1.6 聚酰亚胺薄膜的现状及应用 4

1.1.7 聚酰亚胺薄膜的发展趋势 5

1.2 挠性覆铜板 5

1.2.1 概述 5

1.2.2 挠性覆铜板的特点 6

1.2.3 挠性覆铜板的分类及应用领域 6

1.2.4 2L-FCCL相比3L-FCCL的优势所在 7

1.2.5 2L-FCCL的制造方法 8

1.2.6 FCCL的发展和供应现况 9

1.3 挠性覆铜板用铜箔 11

1.3.1 挠性覆铜板用铜箔简介 11

1.3.2 挠性覆铜板用铜箔要求 11

1.4 本论文的研究目的及内容 12

第二章 实验方法及条件 14

2.1 实验原料 14

2.2 实验仪器 14

2.3 试样的制备 15

2.3.1 PAA溶液的制备 15

2.3.2 热亚胺化制备聚酰亚胺（PI）薄膜 15

2.3.3 制备2L-FCCL 15

2.4 表征手段 15

第三章 实验结果与讨论 17

3.1 红外谱图分析 17

3.2 PI薄膜力学性能分析 17

3.3 PI薄膜的热膨胀系数及玻璃化温度 18

3.4 PI薄膜的形貌分析 19

3.5 剥离强度测试 19

结论 20

参考文献 21

致谢 22

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