论文总字数：24466字

摘 要

芯片在工作的时候会容易变热，保证芯片在可容许的温度范围可以使芯片有一个稳定的工作状态。对运行时的芯片采取的冷却措施，首先要做的是准确测量芯片在运行时的温度变化。采用风扇控制与温度传感器电路相结合的技术，即可以节约设备成本，还可以减少噪音污染，是芯片冷却技术的主要方法和发展趋势。

本文基于STM32芯片的内部温度传感器，通过ADC_IN16通道把内部温度传感器输出的电压转换成数字值，以此来测量STM32芯片运行时的实时温度，再将测量得到的温度显示在LCD1602显示屏上。当STM32芯片的温度上升时，再通过脉冲展宽调制（PWM）技术控制风扇转速来控制STM32芯片运行时的温度。

本文通过keil uVision4软件，对STM32完成初始化，温度的采集及LCD显示，并使风扇转速随着STM32芯片温度的提升而提升，以此来降低STM32芯片运行时的温度。

关键词：STM32芯片 内部温度传感器 脉冲展宽调制技术

Chip Temperature Test and Control Based on STM32

ABSTRACT

Chip at work it will be easy to heat, to ensure that the chip in the allowable temperature range allows the chip to have a stable job status. Cooling measures taken when the chip is running, the first thing to do is to accurately measure the chip temperature changes at runtime. A fan control and temperature sensor circuit combination of technology, which can save the cost of equipment, can also reduce noise pollution, the main methods and trends chip cooling technology.

Based on the STM32 chip's internal temperature sensor channel through ADC_IN16 the internal temperature sensor output voltage into a digital value, in order to measure the real-time temperature STM32 chip run-time, and then the measured temperature is displayed on the LCD1602 display. When the STM32 chip temperature rises, and then to control the fan speed via PWM pulse width modulation to control the temperature STM32 chip.

Through keil uVision4 software, STM32 initialization is complete, the temperature of the acquisition and LCD display, and to enhance the fan speed with the STM32 chip temperature and upgrade, in order to achieve the purpose of reducing the STM32 chip temperature.

Keywords：STM32 chip；The internal temperature sensor； Pulse width modulation Exhibition

目 录

摘 要……………………………………………………………………………………………I

ABSTRACT…………………………………………………………………………………...II

第一章 绪论…………………………………………………………………………………..1

1.1 研究背景及意义...............................................1

1.2 国内外的研究现状.............................................1

1.3 本文所做的工作...............................................2

1.4 本文的结构安排...............................................2

第二章 系统硬件电路……………………………………………………………………4

2.1总体设计方案.................................................4

2.2 STM32的介绍.................................................4

2.2.1 STM32介绍..............................................5

2.2.2 STM32F103C8T6各模块性能................................7

2.2.3 STM32内部温度传感器介绍................................7

2.3 显示屏LCD1602的介绍........................................8

2.3.1 LCD1602的简介..........................................8

2.3.2 LCD1602管脚功能........................................9

2.4 风扇模块...................................................10

2.4.1 常用的控制风扇的方法..................................10

2.4.2 PWM驱动风扇..........................................11

第三章 软件系统的设计……………………………………………………...……….13

3.1 总体设计思路................................................13

3.2 温度采集模块................................................14

3.3 LCD1602显示模块.............................................16

3.4 风扇控制模块................................................21

3.5 总体程序....................................................25

第四章 测试与分析……………………………………………………………………..27

4.1 程序的测试与烧写............................................27

4.2 结果与分析..................................................29

第五章 总结与展望……………………………………………………………………..31

5.1 总结评价....................................................31

5.2 展望........................................................31

参考文献………………………………………………………………………………………32

致谢……………………………………………………………………………………………..34

第一章 绪论

1.1 研究背景及意义

芯片作为现代智能化仪器和仪表的主要元件，一直在不停地发展。随着芯片制作工艺技术的提升，晶体管数量也在不断的增加，电路的密度也随着增加，功率上升，也变得更加容易升高温度。

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