1. 毕业设计（论文）的内容和要求

本实验通过研究emc的组成成分及特性，探讨哪些特性会影响到void的生成、strip warpage/cop以及如何改善void问题，并总结出emc selection guideline以便后期compound筛选。所用的表征方法有hdt、cet等。利用热变形温度分析翘曲量的变化，利用热膨胀系数分析材料收缩的变化。

2. 参考文献

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2. Lin, W., et al, "PoP/CSP Warpage Evaluation and Viscoelastic Modeling," in Proc. IEEE Electronic Components and Technol. Conf. (ECTC), 2008, pp. 1576-1581.
3. Kelly, G., et al, "Accurate prediction of PQFP warpage," in Proc. IEEE Electronic Components and Technol. Conf. (ECTC), 1994, pp. 102#8211;106.
4. Kelly, G., et al, "Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFP#8217;s," IEEE Trans. Component, Packaging and Manufacturing Technology, 1996, pp. 296-300.
5. Yang, D. G., et al, "Prediction of process-induced warpage of IC packagings encapsulated with thermosetting polymers," in Proc. IEEE Electronic Components and Technol. Conf. (ECTC), 2004, pp. 98#8211;105.
6. Yang, D. G., et al, "Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer," IEEE Trans. Component, Packaging and Manufacturing Technology, 2004, pp. 676#8211;683.
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8. Hong, L. C., and Hwang, S. J., "Study of warpage due to P#8211;V-T#8211;C relation of EMC in IC packaging," IEEE Trans. Component, Packaging and Manufacturing Technology, 2004, pp. 371#8211;373.
9. Polsky, Y., and Ume, I. C., "Thermoelastic Modeling of a PWB with Simulated Circuit Traces Subjected to Infrared Reflow Soldering with Experimental Validation," Journal
of Electronic Packaging, 1999, pp. 213-270.
10.Zhai, C. J., Too, S. S., and Master, R. N., "Reliability Modeling of Lidded Flip Chip Packages," in Proc. IEEE Electronic Components and Technol. Conf. (ECTC), 2007, pp. 1091#8211;1096.
11.Yean, C. L., et al, "Consideration of Mold Compound Cure Shrinkage in Finite Element Modeling," Electronic Materials and Packaging Conference, 2006.
12.Zhu, W. H., et al, "Cure shrinkage characterization and its implementation into correlation of warpage between simulation and measurement," in Proc. 5th. Int. Conf. Thermal Mechanical Simulation Experiments MicroElectronics Micro-Systems (EuroSimE#8217;07).
13.Chien, I. Y., et al, "Low Warpage Modeling Compound for PoP, CSP and BGA Applications," Semicon, 2007.

3. 毕业设计（论文）进程安排