论文总字数：16011字

摘 要

环氧树脂是在纤维增强复合材料、封装材料、黏合剂等许多领域都有广泛应用的综合性非常好的一种材料。环氧树脂的性质主要取决于固化剂，固化剂分为胺类、酸酐类、酚类、咪唑类等。本次试验是通过含有双键的化合物改性咪唑,首先是用马来酸酐（MAH）和聚乙二醇单甲醚（MPEG）在对甲苯磺酸（PTS）的催化下合成马来酸酐聚乙二醇双酯（DMM），对不饱和双酯DMM进行纯化处理之后，然后将不饱和双酯DMM与2-苯基咪唑在二氮杂二环（DBU）的催化下进行改性反应，合成并提纯得到改性咪唑（DMMPZ）。实验的主要目的是将改性后的咪唑类潜伏性固化剂，应用环氧模塑料的实际配方中，研究与2-苯基咪唑在相同的配方中对固化过程、环氧固化物各方面性能的影响的对比。通过红外测试得到改性咪唑DMM1000的结构表征；通过差热分析(DSC)得到改性咪唑DMM1000的分解温度为225.45 ℃，再测试E-51/PZ和E-51/DMM1000混合物的固化温度，E-51/PZ体系的固化温度为111.60 ℃，E-51/DMM1000体系的固化温度为149.92 ℃，通过对比可以得到E-51/DMM1000体系的固化温度相对较高，所以改性咪唑DMM1000在室温的潜伏性更好；通过冲击试验测试冲击强度，PZ体系的环氧模塑料的固化样条的冲击强度为4.76 kJ/m²，DMM1000体系的环氧模塑料的固化样条的冲击强度为4.57 kJ/m²，相差不大，基本没有负面影响；通过动态力学热分析分析出改性咪唑DMM1000对固化样条的玻璃化温度，PZ体系的环氧模塑料的固化样条的玻璃化温度为235.30 ℃，DMM1000体系的环氧模塑料的固化样条的玻璃化温度为225.31 ℃，相差不大，基本没有影响；最后通过凝胶化时间的测试粗略的得到改性咪唑DMM1000的储存性能。对比第1天和第13天测得的凝胶点时间的时间变化，175 ℃时测得的时间是比较准确的，100 ℃时测得的数据误差比较大，但是改性咪唑DMM1000的对潜伏性的改性还是有效果的。

关键词：环氧模塑料 潜伏性固化剂 改性咪唑

Effect of latent curing agent on properties of epoxy resin

Abstract

Epoxy resin is a kind of comprehensive material which is widely used in many fields such as fiber reinforced composites, packaging materials and adhesives. The properties of epoxy resin mainly depend on the curing agents, including amine, anhydride, phenolic, imidazoles and so on. This test is modified by compound containing double bonds imidazole, first is to use maleic anhydride (MAH) and polyethylene glycol monomethyl ether (MPEG) under the catalysis of p-toluene sulfonic acid (PTS) polyethylene glycol (peg) double ester synthesis of maleic anhydride (DMM), after the purification process of unsaturated double ester DMM, then put the unsaturated double ester DMM with 2 - phenyl imidazole in nitrogen impurity on two (is a) under the catalysis of the modification reaction, synthesis and purification of modified imidazole (DMMPZ). The main purpose of the experiment is to compare the effects of modified imidazoles latent curing agents on curing process and properties of epoxy cured products in the same formulation of epoxy molding plastics. The structure of modified imidazole is obtained by infrared testing DMM1000 characterization; Modification is obtained by differential thermal analysis (DSC) imidazole DMM1000 decomposition temperature of 225.45 ℃, and then test/p z and E - E - 51 51 / DMM1000 mixture of curing temperature, E - 51 / PZ system of curing temperature is 111.60 ℃, E - 51 / DMM1000 system of curing temperature is 149.92 ℃, through the contrast can be E - 51 / DMM1000 system of curing temperature is relatively high, so the modified imidazole DMM1000 latent at room temperature is better; Impact strength was tested by impact test. Impact strength of epoxy molding plastics curable spline of PZ system was 4.76 kJ/m2, and that of epoxy molding plastics curable spline of DMM1000 system was 4.57 kJ/m2, with little difference and basically no negative impact. Dynamic mechanical and thermal analysis showed that the glass transition temperature of modified imidazole DMM1000 on cured splines was 235.30 ℃ for epoxy molding plastics of PZ system and 225.31 ℃ for epoxy molding plastics of DMM1000 system. Finally, the storage performance of modified imidazole DMM1000 was roughly obtained through the gelation time test. Comparing the time changes of gel point time measured on day 1 and day 13, the time measured at 175 ℃ was relatively accurate, and the data error measured at 100 ℃ was relatively large, but the latent modification of imidazole DMM1000 was still effective

Key Words: Epoxy molding compound Latent curing agent Modified imidazole

目录

摘 要 I

Abstract II

第一章 序论 1

1.1 研究背景 1

1.2咪唑类潜伏性固化剂 1

1.3环氧模塑料 2

1.3.1环氧模塑料用固化促进剂的种类 2

1.3.2环氧模塑料主要组份 3

1.3.3制备工艺 4

1.4改性环氧树脂方法 4

1.4.1利用有机纳米粒子对环氧改性 4

1.4.2氧化石墨烯改性环氧树脂 5

1.4.3利用固化促进剂对环氧改性。 5

1.5本课题烦人研究内容、目的与意义 5

1.5.1实验研究内容 5

1.5.2实验的目的和意义 6

第二章 实验部分 7

2.1实验原料及仪器设备 7

2.1.1实验原料 7

2.1.2实验仪器及设备 8

2.2实验步骤 9

2.2.1不饱和双酯DMM的合成 9

2.2.2改性咪唑DMMPZ的合成 9

2.3表征与测试 10

2.3.1红外光谱分析（FT-IR） 10

2.3.2差热分析（DSC） 10

2.3.3动态力学热分析(DMTA) 10

2.3.4冲击试验 11

2.3.5 凝胶点测试 11

第三章 结果与讨论 12

3.1 红外光谱分析 12

3.2 差热分析（DSC） 13

3.3冲击试验 14

3.4动态力学热分析(DMTA) 15

3.5凝胶点测试 15

第四章 结论与展望 17

参考文献 18

致谢 20

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