论文总字数：17918字

摘 要

挠性覆铜板是一种在笔记本电脑、数码相机、手机、液晶电视、汽车卫星方向定位装置等领域都有广泛应用的一种覆铜板[1-2]。由于PI膜力学性能和电气特性优异，并且具有良好的耐热性，因此目前PI在挠性覆铜板的应用很多，但随着应用的拓展，对PI基材的性能要求进一步提升，因此需要对PI进行改性处理。近年来对于PI薄膜进行改性的研究颇多，其中酸碱处理法、等离子体改性、纳米粒子改性以及表面接枝法比较常见。多巴胺（DA）是这几年来用于表面改性的研究热点，其原因是它对于粘附并还原金属离子有很强的效果，对聚酰亚胺薄表面金属化具有很强的促进作用。

本实验首先用传统的酸碱处理法对聚酰亚胺薄膜表面富羧基活性基团，然后，使用碳二亚胺结构的EDC作为活化羧基的交联剂，形成含异酰基脲结构的中间体，随后带有伯氨基团的多巴胺进攻中间体，形成酰胺键交联并脱除副产物。由于多巴胺的酚羟基活性基团或酚醌自由基及氨基的粘附和还原能力有限，所以需要加入催化剂来辅助化学镀，本文选用的催化剂是银。首先将接枝多巴胺后的聚酰亚胺薄膜放到硝酸银溶液中进行镀银，然后放到还原液硼氢化钠中进行还原，生成致密的银层。再将表面覆盖有银单质层的聚酰亚胺薄膜放到提前配置好的镀铜液中，以银为活性位点进行辅助镀铜，形成的金属层致密且均匀。

关键词：挠性覆铜板 聚酰亚胺 表面改性 多巴胺

ABSTRACT

Flexible copperplate is a kind of copperplate widely used in the fields of laptop computer, digital camera, mobile phone, LCD TV, automobile satellite orientation device and so on [1-2].

Due to PI film mechanical properties and excellent electrical properties, and has good heat resistance, so the PI in the application of flexible copper clad many, but the current PI flexible copper clad because PI resin layer thermal expansion coefficient is higher, the size of the PI flexible copper clad poor stability, curly and PI resin layer and the copper foil adhesion strength is not high.

In recent years, there are many researches on PI film modification, among which acid-base treatment, plasma modification, nano particle modification and surface grafting are common.

Dopamine (DA) is used in the study of the surface modification of hot spots for the last few years and the reason is that it is rich in the amino and activity of phenolic hydroxyl groups, especially rich in phenolic hydroxyl reactive group, adhesion and reduction properties for adhesive and reduction of metal ions have a strong effect, on the surface of the polyimide thin metal has a strong role in promoting.

This experiment first with the traditional acid and alkali treatment on the surface of the polyimide film rich carboxyl active group, then, the use of carbon 2 imine structure of EDC as crosslinking agent of activated carboxyl, formation of different acyl urea of the structure of the intermediates, then attack with "amino group of dopamine intermediates, forming amide bond crosslinking and removing by-products.

Due to the limited adhesion and reduction ability of the phenolic hydroxyl group of dopamine or phenolic quinone radical and amino group, it is necessary to add a catalyst to assist the electroless plating. The catalyst chosen in this paper is silver.

Firstly, dopamine-grafted polyimide films were deposited in silver nitrate solution for silver plating, and then reduced in reducing solution sodium borohydride to form a dense silver layer.

Then, the polyimide film with a silver elemental layer on its surface was placed into the copper plating solution prepared in advance, and the silver was used as the active site for auxiliary copper plating, so that the metal layer formed was dense and uniform.

Key Words:Flexible copper clad plate Polyimide Surface Modification Dopamine

目录

摘要 2

ABSTRACT 3

目录 5

第一章 文献综述 7

1.1 研究背景 7

1.1.1 挠性覆铜板简介 7

1.1.2 PI挠性覆铜板 7

1.2 聚酰亚胺的结构与性能 8

1.2.1 聚酰亚胺的结构及性能 8

1.2.2 聚酰亚胺的合成方法 8

1.2.2 聚酰亚胺的用途 10

1.3 聚酰亚胺表面改性 10

1.3.1 酸碱改性处理 11

1.3.2 等离子体表面改性 11

1.3.3 纳米粒子表面改性 11

1.3.4 表面接枝法 12

1.4 多巴胺在改性中的应用 12

13

1.4.1 多巴胺改性透明质酸（HA）水凝胶 13

1.4.2 多巴胺改性耐水粘合剂 13

1.4.3 多巴胺表面改性碳纤维 13

1.5 本课题的实验内容及意义 14

第二章 实验部分 15

2.1 实验原料及试剂 15

2.2 实验仪器 16

2.3 实验流程 16

2.3.1聚酰亚胺薄膜的制备 16

2.3.2聚酰亚胺薄膜表面的预处理 17

2.3.3聚酰亚胺薄膜表面接枝多巴胺 17

2.3.4聚酰亚胺薄膜表面化学镀 18

2.3.5聚酰亚胺薄膜表面化学镀的流程图 18

第三章 聚酰亚胺复合薄膜性能表征结果与讨论 18

3.1 PI薄膜表面数字显微镜分析 18

3.2 PI薄膜表面红外谱图分析 19

3.3 PI薄膜表面金属层的确定 20

3.4 聚酰亚胺薄膜的SEM电镜分析 21

3.5聚酰亚胺薄膜表面涂层的结合力研究 22

第四章 结论与展望 23

参考文献 24

致 谢 27

文献综述

1.1 研究背景

1.1.1 挠性覆铜板简介

挠性覆铜板是一种在笔记本电脑、数码相机、手机、液晶电视、汽车卫星方向定位装置等领域都有广泛应用的一种覆铜板^[1]。挠性覆铜板是通过在PI薄膜或聚酯薄膜等绝缘基材表面上覆以满足挠曲性能要求的薄铜箔导体制得^[2]，它具有薄、轻和可挠性的特点。

按照不同的分类方法，挠性覆铜板可以分为以下几类：

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