摘 要

微机电系统（MicroElectroMechanic System ,MEMS）是一种行业领先的制造技术平台。微机电系统是以半导体的生产制造技术为基础开始发展起来的。^[1] 微机电系统的核心技术主要建立在半导体技术现有的一系列技术及材料，比如：半导体膜、侵蚀、激光等。因此从生产流程的根本出发，微机电系统的生产创造能力是有高质量保障的。只是微机电系统略侧重于十分精细的机械器件，而且需要用到力学、电学、磁场、自动化学、计算机等众多科目相关技能。

MEMS麦克风是根据MEMS技术制造的一种麦克风，简单的说就是把一个电容器集成在一片微硅晶片上，可以运用表贴工艺进行制造,它能够承受相当高的回流焊温度, CMOS工艺和其它音频电路容易与之相集成, 并具有很高的噪声消除性能与优良的EMI和RF抑制性能。^[2]MEMS麦克风的众多优势应用还在专研之中，即使这样，运用此项技术的多家商户开始在不少应用方面中处于了十分突出的领先，特别对于智能手机市场而言，意义重大。

论文主要研究了用电脑或手机的硅麦克风芯片，实现单片机的数据采集，并用两片LR声道的硅麦芯片，安装距离10mm，在U型支架的对面100mm处安装一个动铁耳机振动发声，通过采集LR双硅麦的声强，实现对介于U型支架之间的薄膜的位置检测。

关键词：MEMS；硅麦克风芯片；单片机

Abstract

Micro-electro -Mechanic System (MEMS) is a very advanced manufacturing technology platform. Microelectromechanical system is developed based on semiconductor manufacturing technology. MEMS technology mainly adopts the thin film of semiconductor technology, corrosion, printing and so on a series of existing technologies and materials, so from manufacturing technology itself, the basic manufacturing technology of MEMS is a mature and reliable. However, MEMS is more oriented towards very precise machining, and involves many subjects such as mechanics, microelectronics, materials, mechanics, chemistry and so on. Its subject surface also expands to the micro - scale force, sound, electricity, magnetism, light, surface and other physics branches.

MEMS microphone is a microphone based on MEMS technology, simple said is the integration of a capacitor in a micro silicon wafers, can use table paste process for manufacturing, it can withstand very high reflow temperature, CMOS process and easy to integrate with other audio circuit, and has the very high noise elimination performance and excellent EMI and RF suppression performance. MEMS microphone remains to be the most potential mining, even so, using the technology of all kinds of products have been in a variety of applications in the field of reflects many obvious advantages, especially in the high-end mobile phone applications.

Thesis mainly studied the use of computer or mobile phone silicon microphone chip, realize the MCU data acquisition, and two pieces of barley silicon chips, LR track installation distance 10 mm, 100 mm across the u-shaped bracket to install a moving iron headset vibration voice, LR double silicon wheat through gathering sound intensity, realize to between u-shaped bracket can detect the position of film.

Key Words：MEMS；Silicon microphone chip；Single chip microcomputer

目录

第1章 绪论 1

1.1 研究背景 1

1.2 硅麦的主要参数 2

1.3 硅麦的现状 2

1.4 硅麦的前景 4

第2章 总体方案设计 7

2.1 硅麦克风部分 7

2.2 单片机部分 8

第3章 硅麦硬件电路设计 9

3.1 硅麦克风结构分析 9

3.2 硅麦克风工作过程 10

3.3 硅麦克风型号选择 11

3.4 双硅麦电路设计 15

3.5 硅麦克风数值预算 19

第4章 单片机信号处理设计 20

4.1 程序设计 21

4.2 数据处理 22

4.3 误差分析 26

4.4 部分代码 27

总结与展望 28

参考文献 29

致 谢 30

第1章 绪论

1.1 研究背景

基于双硅麦的薄膜位置传感器设计主要涉及到硅麦克风的应用，近年来电子产品的发展迅猛，麦克风作为其中之一，也随之崭露头角。当然，所谓的麦克风并不是指常用的话筒，是指传声器。一种能够把声音信号转变为电信号的仪器。麦克风主要被用于电子产品，智能家电等应用，只要涉及到声音操控功能的仪器都离不开它。

麦克风的种类有多种，就以较为常见同时也在市场销售量较高的两种作下基本介绍。第一种是驻极体电容式麦克风（ECM）,第二种是硅麦。驻极体电容式麦克风因其成本和售价都较低被购买者所青睐。不足之处是这种麦克风传声性能不是很好，湿度对其影响较大，占用空间也偏大。